BPmHaKe.Bot
Burger Ping Info Bot
TSMC hat zusammen mit Broadcom die Fläche der Interposer auf 1.700 mm² erhöht, was flexiblere Designs und mehr/größere Chips pro Interposer erlauben soll.
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#Burger-Ping meets HaKe
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TSMC stellt zweite Generation Interposer mit 1.700 mm² vor
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